A DAC 2026 abstract by EKEPOWER's Irving Hsu and Siemens' Lih-Jen Hou describes a Solido flow combining transient, RF, and mixed-signal analysis for printing ICs with motor/printhead drivers, timing references, and RF sensors. The authors report up to 7.6x speed improvement over their conventional methods and an AI-assisted trimming flow that reduces top-level voltage variation; these are presentation-reported results.